1. The key clean (processing) area shall be minimized and separated from the clean walkway, clean maintenance and repair area, so as to avoid or reduce the particle pollution and cross pollution emitted by personnel, process and process equipment, so as to achieve strict cleanliness control requirements and reduce power consumption and cost.
2. The development of process and process equipment needs to be closely combined with clean technology, such as reducing the particles emitted by the process itself and process equipment, using robot to transfer the cassette or SMIF system to avoid direct contact between people and silicon wafer, etc.
3. Based on the above two points, the existing typical dust-free workshop for integrated circuit submicron processing basically consists of two types:
① Tunnel type dust-free workshop. The dust-free workshop is divided into clean processing tunnel (area), clean walkway and clean maintenance and repair tunnel (area). The cleanliness requirements of the processing area are the most stringent, and the cleanliness requirements of other areas and walkways can be lower. At present, there are dust-free workshops that can be used for sub micron processing of integrated circuits in China.
② “微环境”系统无尘车间，这种无尘车间内片盒的传送采用SMIF系统（或类似的系统），它包括：存放片盒的洁净容器（SMIF POD）;能自动接受洁净容器（SMIF POD）并打开容器把片盒送入（送出）设备的加工部位的机械手装置（SMIFARM）.
② "Microenvironment" system is a dust-free workshop. The transfer of film boxes in this dust-free workshop adopts SMIF system (or similar system), which includes: clean container for storing film boxes (SMIF POD); A manipulator device (smiarm) that can automatically accept the clean container (SMIF POD) and open the container to send the cassette to (send out) the processing part of the equipment
The SMIF arm and processing parts are sealed with applicable materials and isolated from the environment of the dust-free workshop. Strictly required clean air is sent into this small space, and the cleanliness of the dust-free workshop can be 100 ~ 1000 (fs-209d), i.e. ≥ 0.5 μ The particles of m shall not be more than 100 ~ 1000 / FT3.
Because the silicon wafer avoids or reduces the direct pollution or cross pollution by the particles emitted by the operators, process equipment and process processing, and the space of the "microenvironment" processing area is very small, it can effectively control the pollution of the silicon wafer by the particles, reduce the cost and operation cost of the dust-free workshop, and the operators can also work in a less strict clean environment.
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